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8479.30.00.00/Silicon Ingot Grinder/Japan

Silicon Ingot Grinder from Japan

Precision grinders shape silicon ingots to exact diameters with orientation flats for wafer slicing. HTS 8479.30.00.00 specifically covers crystal grinders per statistical note (a)(ii)(A).

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify grinding wheel composition (diamond/CBN) for silicon/gallium arsenide

• Include coolant filtration specs for silicon particle management

Silicon Ingot Grinder from Japan — Import Duty Rate | HTS 8479.30.00.00