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8479.30.00.00/Silicon Ingot Grinder/Japan

Silicon Ingot Grinder from Japan

Precision grinders shape silicon ingots to exact diameters with orientation flats for wafer slicing. HTS 8479.30.00.00 specifically covers crystal grinders per statistical note (a)(ii)(A).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify grinding wheel composition (diamond/CBN) for silicon/gallium arsenide

• Include coolant filtration specs for silicon particle management