Wafer Edge Profiling Machine

Machines profile wafer edges to prevent chipping and enable handling during fabrication. Part of wafer preparation sequence under HTS 8479.30.00.00 statistical notes.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8456.30Lower: 12.4% vs 35%

If general edge finishing machines

Machine tool edge working has separate classification.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Specify edge profiles (e.g

chisel, buttock) matching statistical note tolerances

Laser vs mechanical profiling affects classification documentation

Cleanroom edge inspection integration common pitfall

Related Products under HTS 8479.30.00.00

Czochralski Crystal Puller

A Czochralski crystal puller is specialized equipment used to grow monocrystalline silicon boules from molten silicon for semiconductor wafer production. It falls under HTS 8479.30.00.00 as machinery for processing semiconductor materials, akin to treating ligneous materials, per statistical notes on semiconductor manufacturing equipment.

Float Zone Crystal Grower

Float zone crystal growers produce high-purity monocrystalline silicon by zone melting, avoiding contamination from crucibles. Classified under HTS 8479.30.00.00 for semiconductor material processing equipment as per statistical notes.

Semiconductor Wafer Lapper

Wafer lappers use loose abrasives to achieve initial flatness on semiconductor wafers before polishing. Classified HTS 8479.30.00.00 per statistical note (a)(ii)(C) for wafer preparation.

Chemical Mechanical Planarization Tool

CMP tools use chemical slurry and mechanical polishing pads to planarize wafers during device fabrication. While primarily fabrication equipment, preparatory CMP tools fall under HTS 8479.30.00.00 statistical notes for wafer preparation.

Gallium Arsenide Wafer Slicer

Specialized saws for slicing brittle gallium arsenide wafers from compound semiconductor boules. Covered under HTS 8479.30.00.00 statistical note for semiconductor materials including gallium arsenide.

Crystal boule Grinder with Flats

Grinds precise flats on semiconductor boules indicating crystal orientation and doping type. Essential per statistical note (a)(ii)(A) for wafer preparation.