Crystal Boule Grinder
Crystal boule grinders precisely shape semiconductor boules to exact diameters and grind flats indicating conductivity type. Under HTS 8479.30.00.00 per statistical note (a)(ii)(A) for wafer preparation equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified as general honing/grinding machines not specific to semiconductors
Generic grinding machines for metal/metal carbides fall under Chapter 84 honing machines.
If imported as parts for existing semiconductor grinders
Parts of semiconductor manufacturing machines classified separately.
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Import Tips & Compliance
• Provide detailed blueprints showing grinding for semiconductor boule diameters (e.g
• 200-450mm)
• Include material safety data for diamond grinding wheels used on silicon carbide
Related Products under HTS 8479.30.00.00
Czochralski Crystal Puller
A Czochralski crystal puller is specialized equipment used to grow monocrystalline silicon boules from molten silicon for semiconductor wafer production. It falls under HTS 8479.30.00.00 as machinery for processing semiconductor materials, akin to treating ligneous materials, per statistical notes on semiconductor manufacturing equipment.
Float Zone Crystal Grower
Float zone crystal growers produce high-purity monocrystalline silicon by zone melting, avoiding contamination from crucibles. Classified under HTS 8479.30.00.00 for semiconductor material processing equipment as per statistical notes.
Semiconductor Wafer Lapper
Wafer lappers use loose abrasives to achieve initial flatness on semiconductor wafers before polishing. Classified HTS 8479.30.00.00 per statistical note (a)(ii)(C) for wafer preparation.
Chemical Mechanical Planarization Tool
CMP tools use chemical slurry and mechanical polishing pads to planarize wafers during device fabrication. While primarily fabrication equipment, preparatory CMP tools fall under HTS 8479.30.00.00 statistical notes for wafer preparation.
Gallium Arsenide Wafer Slicer
Specialized saws for slicing brittle gallium arsenide wafers from compound semiconductor boules. Covered under HTS 8479.30.00.00 statistical note for semiconductor materials including gallium arsenide.
Wafer Edge Profiling Machine
Machines profile wafer edges to prevent chipping and enable handling during fabrication. Part of wafer preparation sequence under HTS 8479.30.00.00 statistical notes.