Crystal Boule Grinder from Japan
Crystal boule grinders precisely shape semiconductor boules to exact diameters and grind flats indicating conductivity type. Under HTS 8479.30.00.00 per statistical note (a)(ii)(A) for wafer preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide detailed blueprints showing grinding for semiconductor boule diameters (e.g
• 200-450mm)
• Include material safety data for diamond grinding wheels used on silicon carbide