Crystal Boule Grinder from Japan
Crystal boule grinders precisely shape semiconductor boules to exact diameters and grind flats indicating conductivity type. Under HTS 8479.30.00.00 per statistical note (a)(ii)(A) for wafer preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide detailed blueprints showing grinding for semiconductor boule diameters (e.g
• 200-450mm)
• Include material safety data for diamond grinding wheels used on silicon carbide