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8479.30.00.00/Chemical Mechanical Planarization Tool/Japan

Chemical Mechanical Planarization Tool from Japan

CMP tools use chemical slurry and mechanical polishing pads to planarize wafers during device fabrication. While primarily fabrication equipment, preparatory CMP tools fall under HTS 8479.30.00.00 statistical notes for wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Distinguish pre-fab CMP (8479.30) from device-fab CMP (other headings); provide process flow docs

• Document slurry chemistry compatibility (e.g

• ceria vs silica)

• Ensure cleanroom compatibility certification

Chemical Mechanical Planarization Tool from Japan — Import Duty Rate | HTS 8479.30.00.00