8479.30.00.00/Chemical Mechanical Planarization Tool/Mexico

Chemical Mechanical Planarization Tool from Mexico

CMP tools use chemical slurry and mechanical polishing pads to planarize wafers during device fabrication. While primarily fabrication equipment, preparatory CMP tools fall under HTS 8479.30.00.00 statistical notes for wafer preparation.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Distinguish pre-fab CMP (8479.30) from device-fab CMP (other headings); provide process flow docs

• Document slurry chemistry compatibility (e.g

• ceria vs silica)

• Ensure cleanroom compatibility certification

Chemical Mechanical Planarization Tool from Mexico — Import Duty Rate | HTS 8479.30.00.00