Chemical Mechanical Planarization Tool from Germany
CMP tools use chemical slurry and mechanical polishing pads to planarize wafers during device fabrication. While primarily fabrication equipment, preparatory CMP tools fall under HTS 8479.30.00.00 statistical notes for wafer preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Distinguish pre-fab CMP (8479.30) from device-fab CMP (other headings); provide process flow docs
• Document slurry chemistry compatibility (e.g
• ceria vs silica)
• Ensure cleanroom compatibility certification