8479.30.00.00/Chemical Mechanical Planarization Tool/China

Chemical Mechanical Planarization Tool from China

CMP tools use chemical slurry and mechanical polishing pads to planarize wafers during device fabrication. While primarily fabrication equipment, preparatory CMP tools fall under HTS 8479.30.00.00 statistical notes for wafer preparation.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

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Import Tips

• Distinguish pre-fab CMP (8479.30) from device-fab CMP (other headings); provide process flow docs

• Document slurry chemistry compatibility (e.g

• ceria vs silica)

• Ensure cleanroom compatibility certification