Handheld Pneumatic Wafer Lapping Tool
Pneumatic hand tool for lapping semiconductor wafers to achieve precise flatness before fabrication. Falls under HTS 8467.19.50.90 as other pneumatic hand tools for wafer preparation in semiconductor processing. Ensures surface tolerances critical for device yield.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as component for testing/processing apparatus
Parts of semiconductor testing machines (often Ch 90 linked) classified under 8466 specifics.
If specifically for chain making or wire drawing
Narrower subheadings exist for certain metalworking; semiconductor use stays 'other'.
If for semiconductor manufacturing machines broadly
Unspecified machines for semiconductor processes may use 8479 if not fitting 8466.
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Import Tips & Compliance
• Certify lapping plate materials (e.g
• cast iron or copper) and pressure specs for cleanroom semiconductor use
• Use invoices specifying 'for monocrystalline silicon/gallium arsenide wafers' to match statistical notes
Related Products under HTS 8467.19.50.90
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Handheld pneumatic grinder for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Under HTS 8467.19.50.90 as other pneumatic tools for wafer prep equipment. Maintains edge strength for fab processing.
Hand Pneumatic Wafer Surface Lapper
Pneumatic handheld lapper for semiconductor wafer surface flattening before polishing steps. Fits HTS 8467.19.50.90 as wafer preparation equipment tool. Achieves sub-micron flatness for device fabrication.
Pneumatic Semiconductor Boule Flat Grinder
Pneumatic tool for grinding orientation flats on semiconductor boules indicating resistivity. HTS 8467.19.50.90 per statistical note (a)(ii)(A). Essential for wafer identification in fabs.
Pneumatic Wafer Grinding Tool
A handheld pneumatic grinder specifically designed for grinding semiconductor crystal boules to precise diameters required for wafer production. It falls under HTS 8467.19.50.90 as a pneumatic tool for hand-held use in semiconductor manufacturing processes like crystal preparation. This tool ensures accurate flats indicating conductivity type and resistivity.
Pneumatic Wafer Slicing Pneumatic Saw
Hand-held pneumatic saw used to slice thin wafers from monocrystalline semiconductor boules in wafer preparation. Classified under HTS 8467.19.50.90 as other pneumatic hand tools for semiconductor material processing. Precision blade ensures minimal kerf loss for high-yield wafer production.
Pneumatic Crystal Boule Grinder
Portable pneumatic hand grinder for shaping semiconductor crystal boules by grinding to exact diameters and flats. HTS 8467.19.50.90 covers this as other pneumatic tools used in Czochralski crystal grower output processing. Critical for wafer uniformity in semiconductor fabrication.