Handheld Pneumatic Wafer Lapping Tool from China
Pneumatic hand tool for lapping semiconductor wafers to achieve precise flatness before fabrication. Falls under HTS 8467.19.50.90 as other pneumatic hand tools for wafer preparation in semiconductor processing. Ensures surface tolerances critical for device yield.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Certify lapping plate materials (e.g
• cast iron or copper) and pressure specs for cleanroom semiconductor use
• Use invoices specifying 'for monocrystalline silicon/gallium arsenide wafers' to match statistical notes