Other
Tools for working in the hand, pneumatic, hydraulic or with self-contained electric or nonelectric motor, and parts thereof: > Pneumatic: > Other: > Other > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8467.19.50.90
Portable Pneumatic Wafer Edge Grinder
Handheld pneumatic grinder for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Under HTS 8467.19.50.90 as other pneumatic tools for wafer prep equipment. Maintains edge strength for fab processing.
Hand Pneumatic Wafer Surface Lapper
Pneumatic handheld lapper for semiconductor wafer surface flattening before polishing steps. Fits HTS 8467.19.50.90 as wafer preparation equipment tool. Achieves sub-micron flatness for device fabrication.
Pneumatic Semiconductor Boule Flat Grinder
Pneumatic tool for grinding orientation flats on semiconductor boules indicating resistivity. HTS 8467.19.50.90 per statistical note (a)(ii)(A). Essential for wafer identification in fabs.
Pneumatic Wafer Grinding Tool
A handheld pneumatic grinder specifically designed for grinding semiconductor crystal boules to precise diameters required for wafer production. It falls under HTS 8467.19.50.90 as a pneumatic tool for hand-held use in semiconductor manufacturing processes like crystal preparation. This tool ensures accurate flats indicating conductivity type and resistivity.
Pneumatic Wafer Slicing Pneumatic Saw
Hand-held pneumatic saw used to slice thin wafers from monocrystalline semiconductor boules in wafer preparation. Classified under HTS 8467.19.50.90 as other pneumatic hand tools for semiconductor material processing. Precision blade ensures minimal kerf loss for high-yield wafer production.
Pneumatic Crystal Boule Grinder
Portable pneumatic hand grinder for shaping semiconductor crystal boules by grinding to exact diameters and flats. HTS 8467.19.50.90 covers this as other pneumatic tools used in Czochralski crystal grower output processing. Critical for wafer uniformity in semiconductor fabrication.
Handheld Pneumatic Wafer Lapping Tool
Pneumatic hand tool for lapping semiconductor wafers to achieve precise flatness before fabrication. Falls under HTS 8467.19.50.90 as other pneumatic hand tools for wafer preparation in semiconductor processing. Ensures surface tolerances critical for device yield.
Pneumatic Semiconductor Wafer Polisher
Handheld pneumatic polisher for final surface finishing of semiconductor wafers post-grinding. Classified in HTS 8467.19.50.90 for pneumatic tools in wafer preparation equipment per statistical notes. Delivers mirror-like flatness for photolithography processes.
Pneumatic Handheld Crystal Puller Finisher
Pneumatic finishing tool for hand-trimming crystal boules from Czochralski pullers in semiconductor production. HTS 8467.19.50.90 applies to such specialized pneumatic hand tools for crystal grower output. Ensures boule dimensions for optimal wafer slicing.
Pneumatic Float Zone Crystal Grinder
Specialized pneumatic hand grinder for float zone semiconductor crystals, grinding to wafer-ready specs. HTS 8467.19.50.90 for pneumatic tools in crystal grower/puller finishing per notes. Handles high-purity silicon/gallium arsenide boules.