Pneumatic Semiconductor Wafer Polisher
Handheld pneumatic polisher for final surface finishing of semiconductor wafers post-grinding. Classified in HTS 8467.19.50.90 for pneumatic tools in wafer preparation equipment per statistical notes. Delivers mirror-like flatness for photolithography processes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily for wafer testing rather than preparation
Semiconductor testing equipment in Chapter 90 separates from processing tools.
If as parts of full crystal grower/puller machines
Integral parts of boule manufacturing equipment classified with the machine.
If manual non-powered polishing tool
Hand tools without power source fall into Chapter 82 base metal articles.
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Import Tips & Compliance
• Include slurry compatibility details and RPM specs in documentation to prove semiconductor-specific design
• Register for temporary importation if for demo in US fabs to defer duties
Related Products under HTS 8467.19.50.90
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Hand Pneumatic Wafer Surface Lapper
Pneumatic handheld lapper for semiconductor wafer surface flattening before polishing steps. Fits HTS 8467.19.50.90 as wafer preparation equipment tool. Achieves sub-micron flatness for device fabrication.
Pneumatic Semiconductor Boule Flat Grinder
Pneumatic tool for grinding orientation flats on semiconductor boules indicating resistivity. HTS 8467.19.50.90 per statistical note (a)(ii)(A). Essential for wafer identification in fabs.
Pneumatic Wafer Grinding Tool
A handheld pneumatic grinder specifically designed for grinding semiconductor crystal boules to precise diameters required for wafer production. It falls under HTS 8467.19.50.90 as a pneumatic tool for hand-held use in semiconductor manufacturing processes like crystal preparation. This tool ensures accurate flats indicating conductivity type and resistivity.
Pneumatic Wafer Slicing Pneumatic Saw
Hand-held pneumatic saw used to slice thin wafers from monocrystalline semiconductor boules in wafer preparation. Classified under HTS 8467.19.50.90 as other pneumatic hand tools for semiconductor material processing. Precision blade ensures minimal kerf loss for high-yield wafer production.
Pneumatic Crystal Boule Grinder
Portable pneumatic hand grinder for shaping semiconductor crystal boules by grinding to exact diameters and flats. HTS 8467.19.50.90 covers this as other pneumatic tools used in Czochralski crystal grower output processing. Critical for wafer uniformity in semiconductor fabrication.