Pneumatic Semiconductor Wafer Polisher from Japan
Handheld pneumatic polisher for final surface finishing of semiconductor wafers post-grinding. Classified in HTS 8467.19.50.90 for pneumatic tools in wafer preparation equipment per statistical notes. Delivers mirror-like flatness for photolithography processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include slurry compatibility details and RPM specs in documentation to prove semiconductor-specific design
• Register for temporary importation if for demo in US fabs to defer duties