Pneumatic Wafer Grinding Tool
A handheld pneumatic grinder specifically designed for grinding semiconductor crystal boules to precise diameters required for wafer production. It falls under HTS 8467.19.50.90 as a pneumatic tool for hand-held use in semiconductor manufacturing processes like crystal preparation. This tool ensures accurate flats indicating conductivity type and resistivity.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If designed exclusively for semiconductor testing
Testing apparatus for semiconductor devices falls under Chapter 90, not tools for material processing.
If imported as a part for larger semiconductor equipment
Parts for machines of heading 8466 (semiconductor manufacturing machines) are classified separately from complete hand tools.
If with self-contained non-electric motor instead of pneumatic
Tools with non-electric motors like combustion engines use different subheadings within 8467.
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Import Tips & Compliance
• Verify tool meets pneumatic specifications and include manufacturer specs confirming hand-held use in semiconductor processing to avoid misclassification
• Provide end-use certificates proving application in wafer preparation to qualify for potential duty reductions under tech import programs
Related Products under HTS 8467.19.50.90
Portable Pneumatic Wafer Edge Grinder
Handheld pneumatic grinder for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Under HTS 8467.19.50.90 as other pneumatic tools for wafer prep equipment. Maintains edge strength for fab processing.
Hand Pneumatic Wafer Surface Lapper
Pneumatic handheld lapper for semiconductor wafer surface flattening before polishing steps. Fits HTS 8467.19.50.90 as wafer preparation equipment tool. Achieves sub-micron flatness for device fabrication.
Pneumatic Semiconductor Boule Flat Grinder
Pneumatic tool for grinding orientation flats on semiconductor boules indicating resistivity. HTS 8467.19.50.90 per statistical note (a)(ii)(A). Essential for wafer identification in fabs.
Pneumatic Wafer Slicing Pneumatic Saw
Hand-held pneumatic saw used to slice thin wafers from monocrystalline semiconductor boules in wafer preparation. Classified under HTS 8467.19.50.90 as other pneumatic hand tools for semiconductor material processing. Precision blade ensures minimal kerf loss for high-yield wafer production.
Pneumatic Crystal Boule Grinder
Portable pneumatic hand grinder for shaping semiconductor crystal boules by grinding to exact diameters and flats. HTS 8467.19.50.90 covers this as other pneumatic tools used in Czochralski crystal grower output processing. Critical for wafer uniformity in semiconductor fabrication.
Handheld Pneumatic Wafer Lapping Tool
Pneumatic hand tool for lapping semiconductor wafers to achieve precise flatness before fabrication. Falls under HTS 8467.19.50.90 as other pneumatic hand tools for wafer preparation in semiconductor processing. Ensures surface tolerances critical for device yield.