Pneumatic Wafer Grinding Tool from Japan
A handheld pneumatic grinder specifically designed for grinding semiconductor crystal boules to precise diameters required for wafer production. It falls under HTS 8467.19.50.90 as a pneumatic tool for hand-held use in semiconductor manufacturing processes like crystal preparation. This tool ensures accurate flats indicating conductivity type and resistivity.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify tool meets pneumatic specifications and include manufacturer specs confirming hand-held use in semiconductor processing to avoid misclassification
• Provide end-use certificates proving application in wafer preparation to qualify for potential duty reductions under tech import programs