Other
Tools for working in the hand, pneumatic, hydraulic or with self-contained electric or nonelectric motor, and parts thereof: > Other tools: > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Subheadings
Products classified under HTS 8467.89.50
Self-Contained Electric Wafer Flattener
Electric handheld flattener critical for wafer surface flatness.
Hydraulic Crystal Grinder Attachment
Hydraulic hand attachment for crystal grinding.
Pneumatic Semiconductor Polishing Wand
Pneumatic wand-style polisher for wafers.
Battery Float Zone Crystal Finisher
Cordless finisher for float zone crystal processing.
Hydraulic Hand Wafer Grinder
Portable hydraulic grinder for initial wafer thickness reduction after slicing. HTS 8467.89.50 hydraulic hand tool for semiconductor wafer grinders.
Electric Semiconductor Wafer Deburrer
Handheld electric tool removing burrs from sliced semiconductor wafers. HTS 8467.89.50 electric hand tool for wafer preparation.
Cordless Crystal Boule Diameter Trimmer
Battery-powered handheld trimmer for precise crystal boule diameter control. For semiconductor crystal grinders.
Pneumatic Wafer Surface Lapper
Pneumatic hand lapper for semiconductor wafer flatness.
Pneumatic Crystal Grinder
A handheld pneumatic tool used to grind semiconductor crystal boules to precise diameters for wafer production. It falls under HTS 8467.89.50 as a pneumatic hand tool for specialized material processing in semiconductor manufacturing. Designed for high-precision work on monocrystalline materials like silicon.
Cordless Electric Wafer Edge Trimmer
Battery-powered handheld tool for trimming edges of semiconductor wafers to exact tolerances post-slicing. Classified in HTS 8467.89.50 as a self-contained electric motor hand tool for semiconductor wafer preparation. Ensures flatness and dimensional accuracy for fabrication processes.
Hydraulic Wafer Lapping Tool
Handheld hydraulic tool for lapping semiconductor wafers to achieve ultra-flat surfaces before fabrication. HTS 8467.89.50 covers it as a hydraulic hand tool specialized for wafer preparation in crystal processing. Critical for bringing wafers within tight dimensional tolerances.
Pneumatic Wafer Slicing Assist Tool
Pneumatic handheld guide and trimmer used alongside saws for precise wafer slicing from crystal boules. Falls under HTS 8467.89.50 as other pneumatic hand tools for semiconductor material processing. Aids in maintaining wafer integrity during boule slicing.
Electric Handheld Crystal Puller Finisher
Self-contained electric motor tool for finishing surfaces of crystal pullers in Czochralski semiconductor growth. Classified HTS 8467.89.50 for electric hand tools in crystal grower/puller maintenance. Ensures purity and precision in monocrystalline boule production.
Battery-Powered Wafer Polisher
Cordless handheld polisher for final surface preparation of semiconductor wafers pre-fabrication. HTS 8467.89.50 as self-contained electric polishing tool for wafer grinders/lappers/polishers in statistical notes.
Pneumatic Flats Grinder for Crystal Boules
Handheld pneumatic grinder for creating orientation flats on semiconductor crystal boules indicating conductivity. Under HTS 8467.89.50 for crystal grinders in wafer preparation equipment per statistical notes.