Hydraulic Wafer Lapping Tool
Handheld hydraulic tool for lapping semiconductor wafers to achieve ultra-flat surfaces before fabrication. HTS 8467.89.50 covers it as a hydraulic hand tool specialized for wafer preparation in crystal processing. Critical for bringing wafers within tight dimensional tolerances.
Import Duty Rates by Country of Origin
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If part of automated lapping stations for boule processing
Larger lapping/polishing apparatus for semiconductor wafers are in 8466.
If imported as hydraulic parts/components only, not full hand tool
Separate hydraulic engines or pumps classify under 8412, not assembled tools.
If for lapping tools with optical inspection features
Hypodermic or precision lapping with measuring shifts to Chapter 90.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Document hydraulic pressure specs and semiconductor end-use to distinguish from general lapping tools
• Ensure CE or equivalent marking for hydraulic components to pass safety inspections
Related Products under HTS 8467.89.50
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Electric handheld flattener critical for wafer surface flatness.
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Battery Float Zone Crystal Finisher
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Hydraulic Hand Wafer Grinder
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Electric Semiconductor Wafer Deburrer
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