Hydraulic Wafer Lapping Tool from Germany
Handheld hydraulic tool for lapping semiconductor wafers to achieve ultra-flat surfaces before fabrication. HTS 8467.89.50 covers it as a hydraulic hand tool specialized for wafer preparation in crystal processing. Critical for bringing wafers within tight dimensional tolerances.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Document hydraulic pressure specs and semiconductor end-use to distinguish from general lapping tools
• Ensure CE or equivalent marking for hydraulic components to pass safety inspections