Other
Tools for working in the hand, pneumatic, hydraulic or with self-contained electric or nonelectric motor, and parts thereof: > Other tools: > Other: > Other > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Products classified under HTS 8467.89.50.90
Pneumatic Crystal Grinder
A handheld pneumatic tool used to grind semiconductor crystal boules to precise diameters and flats indicating conductivity type and resistivity. It falls under HTS 8467.89.50.90 as a pneumatic hand tool for semiconductor material processing. Designed for high-precision work in wafer manufacturing.
Cordless Electric Wafer Edge Trimmer
Battery-powered handheld tool for trimming edges of semiconductor wafers post-slicing to achieve dimensional tolerances. Classified in HTS 8467.89.50.90 as a self-contained electric hand tool for semiconductor wafer preparation. Ensures flatness critical for fabrication processes.
Hydraulic Wafer Lapping Tool
Handheld hydraulic tool for lapping semiconductor wafers to achieve surface flatness within strict tolerances for device fabrication. HTS 8467.89.50.90 covers hydraulic hand tools used in wafer preparation per statistical notes. Critical for removing material precisely.
Pneumatic Wafer Polishing Pencil
Precision pneumatic hand tool resembling a pencil for final polishing of semiconductor wafer surfaces before fabrication. Falls under HTS 8467.89.50.90 as other pneumatic tools for wafer polishers in semiconductor processing. Achieves mirror finish for device yield.
Electric Handheld Crystal Puller Assist Tool
Corded electric hand tool assisting Czochralski crystal pullers by manipulating seed crystals during semiconductor boule growth. HTS 8467.89.50.90 for electric hand tools in crystal grower equipment. Supports monocrystalline silicon production.
Battery-Powered Wafer Slicing Guide Tool
Self-contained electric handheld guide ensuring precise alignment during wafer slicing from semiconductor boules. Classified HTS 8467.89.50.90 as other electric hand tools for wafer slicing saws. Maintains cut parallelism.
Pneumatic Boule Flattener
Handheld pneumatic tool for flattening ends of semiconductor crystal boules prior to slicing into wafers. HTS 8467.89.50.90 covers pneumatic tools in crystal grinder category per statistical notes. Prepares for uniform wafer thickness.
Cordless Semiconductor Wafer Deburrer
Battery-operated handheld deburring tool specifically for removing burrs from sliced semiconductor wafers. Falls under HTS 8467.89.50.90 as self-contained electric tool for wafer preparation equipment. Prevents contamination in fab processes.
Hydraulic Crystal Diameter Gauge Tool
Handheld hydraulic tool that applies controlled pressure to measure and adjust crystal boule diameters during grinding. HTS 8467.89.50.90 for hydraulic hand tools in semiconductor crystal processing. Ensures wafer spec compliance.
Electric Wafer Surface Profiler
Handheld electric tool for profiling wafer surfaces to verify flatness post-lapping in semiconductor prep. Classified HTS 8467.89.50.90 as electric hand tool for wafer grinders/lappers. Critical quality control step.