8467.89.50/Hydraulic Wafer Lapping Tool/Mexico

Hydraulic Wafer Lapping Tool from Mexico

Handheld hydraulic tool for lapping semiconductor wafers to achieve ultra-flat surfaces before fabrication. HTS 8467.89.50 covers it as a hydraulic hand tool specialized for wafer preparation in crystal processing. Critical for bringing wafers within tight dimensional tolerances.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document hydraulic pressure specs and semiconductor end-use to distinguish from general lapping tools

• Ensure CE or equivalent marking for hydraulic components to pass safety inspections

Hydraulic Wafer Lapping Tool from Mexico — Import Duty Rate | HTS 8467.89.50