Portable Pneumatic Wafer Edge Grinder
Handheld pneumatic grinder for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Under HTS 8467.19.50.90 as other pneumatic tools for wafer prep equipment. Maintains edge strength for fab processing.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If parts for semiconductor processing machines
If not standalone hand tool, classifies as machine part.
If simple interchangeable tool bits only
Interchangeable spindles or bits without power in Chapter 82.
If broader semiconductor machines not specified
Catch-all for unlisted semiconductor apparatus.
Not sure which classification is right?
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Import Tips & Compliance
• Specify edge chamfer angles (e.g
• 45°) and wafer sizes (4-12 inch) in import docs
• Comply with vibration standards (ISO 5349) for cleanroom approval
• Avoid mislabeling as general die grinder, which could trigger lower duties but audits
Related Products under HTS 8467.19.50.90
Hand Pneumatic Wafer Surface Lapper
Pneumatic handheld lapper for semiconductor wafer surface flattening before polishing steps. Fits HTS 8467.19.50.90 as wafer preparation equipment tool. Achieves sub-micron flatness for device fabrication.
Pneumatic Semiconductor Boule Flat Grinder
Pneumatic tool for grinding orientation flats on semiconductor boules indicating resistivity. HTS 8467.19.50.90 per statistical note (a)(ii)(A). Essential for wafer identification in fabs.
Pneumatic Wafer Grinding Tool
A handheld pneumatic grinder specifically designed for grinding semiconductor crystal boules to precise diameters required for wafer production. It falls under HTS 8467.19.50.90 as a pneumatic tool for hand-held use in semiconductor manufacturing processes like crystal preparation. This tool ensures accurate flats indicating conductivity type and resistivity.
Pneumatic Wafer Slicing Pneumatic Saw
Hand-held pneumatic saw used to slice thin wafers from monocrystalline semiconductor boules in wafer preparation. Classified under HTS 8467.19.50.90 as other pneumatic hand tools for semiconductor material processing. Precision blade ensures minimal kerf loss for high-yield wafer production.
Pneumatic Crystal Boule Grinder
Portable pneumatic hand grinder for shaping semiconductor crystal boules by grinding to exact diameters and flats. HTS 8467.19.50.90 covers this as other pneumatic tools used in Czochralski crystal grower output processing. Critical for wafer uniformity in semiconductor fabrication.
Handheld Pneumatic Wafer Lapping Tool
Pneumatic hand tool for lapping semiconductor wafers to achieve precise flatness before fabrication. Falls under HTS 8467.19.50.90 as other pneumatic hand tools for wafer preparation in semiconductor processing. Ensures surface tolerances critical for device yield.