Portable Pneumatic Wafer Edge Grinder from China
Handheld pneumatic grinder for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Under HTS 8467.19.50.90 as other pneumatic tools for wafer prep equipment. Maintains edge strength for fab processing.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Specify edge chamfer angles (e.g
• 45°) and wafer sizes (4-12 inch) in import docs
• Comply with vibration standards (ISO 5349) for cleanroom approval
• Avoid mislabeling as general die grinder, which could trigger lower duties but audits