8467.19.50.90/Portable Pneumatic Wafer Edge Grinder/Japan

Portable Pneumatic Wafer Edge Grinder from Japan

Handheld pneumatic grinder for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Under HTS 8467.19.50.90 as other pneumatic tools for wafer prep equipment. Maintains edge strength for fab processing.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify edge chamfer angles (e.g

• 45°) and wafer sizes (4-12 inch) in import docs

• Comply with vibration standards (ISO 5349) for cleanroom approval

• Avoid mislabeling as general die grinder, which could trigger lower duties but audits

Portable Pneumatic Wafer Edge Grinder from Japan — Import Duty Rate | HTS 8467.19.50.90