Portable Pneumatic Wafer Edge Grinder from Japan
Handheld pneumatic grinder for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Under HTS 8467.19.50.90 as other pneumatic tools for wafer prep equipment. Maintains edge strength for fab processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge chamfer angles (e.g
• 45°) and wafer sizes (4-12 inch) in import docs
• Comply with vibration standards (ISO 5349) for cleanroom approval
• Avoid mislabeling as general die grinder, which could trigger lower duties but audits