8467.19.50.90/Portable Pneumatic Wafer Edge Grinder/Japan

Portable Pneumatic Wafer Edge Grinder from Japan

Handheld pneumatic grinder for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Under HTS 8467.19.50.90 as other pneumatic tools for wafer prep equipment. Maintains edge strength for fab processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify edge chamfer angles (e.g

• 45°) and wafer sizes (4-12 inch) in import docs

• Comply with vibration standards (ISO 5349) for cleanroom approval

• Avoid mislabeling as general die grinder, which could trigger lower duties but audits