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8467.19.50.90/Handheld Pneumatic Wafer Lapping Tool/Mexico

Handheld Pneumatic Wafer Lapping Tool from Mexico

Pneumatic hand tool for lapping semiconductor wafers to achieve precise flatness before fabrication. Falls under HTS 8467.19.50.90 as other pneumatic hand tools for wafer preparation in semiconductor processing. Ensures surface tolerances critical for device yield.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Certify lapping plate materials (e.g

• cast iron or copper) and pressure specs for cleanroom semiconductor use

• Use invoices specifying 'for monocrystalline silicon/gallium arsenide wafers' to match statistical notes

Handheld Pneumatic Wafer Lapping Tool from Mexico — Import Duty Rate | HTS 8467.19.50.90