Handheld Pneumatic Wafer Lapping Tool from Japan
Pneumatic hand tool for lapping semiconductor wafers to achieve precise flatness before fabrication. Falls under HTS 8467.19.50.90 as other pneumatic hand tools for wafer preparation in semiconductor processing. Ensures surface tolerances critical for device yield.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify lapping plate materials (e.g
• cast iron or copper) and pressure specs for cleanroom semiconductor use
• Use invoices specifying 'for monocrystalline silicon/gallium arsenide wafers' to match statistical notes