Handheld Pneumatic Wafer Lapping Tool from Canada
Pneumatic hand tool for lapping semiconductor wafers to achieve precise flatness before fabrication. Falls under HTS 8467.19.50.90 as other pneumatic hand tools for wafer preparation in semiconductor processing. Ensures surface tolerances critical for device yield.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify lapping plate materials (e.g
• cast iron or copper) and pressure specs for cleanroom semiconductor use
• Use invoices specifying 'for monocrystalline silicon/gallium arsenide wafers' to match statistical notes