Semiconductor Wafer Polisher Head Assembly
Complete polishing head with carrier film, retaining ring, and drive shaft for single/dual wafer polishers. Applies 2-7 psi pressure for planarization. Major replacement part for wafer polishers in 8442.40.00.00.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If molded plastic carrier components
Injection molded plastic parts may classify under Chapter 84 if not assemblies.
If post-prep semiconductor processing polishers
Device fabrication polishers shift per statistical note distinctions.
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Import Tips & Compliance
• Document removal rate specs (0.5-2.0 μm/min) and compatible pad types
• Complete head vs consumable pieces (retainer ring only) affects duty treatment
• Edge bead removal capability must be specified for advanced wafer classification
Related Products under HTS 8442.40.00.00
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Wafer Lapping Machine Polishing Pad
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Wafer Grinder Air Bearing Chuck
Porous ceramic air bearing chuck that holds semiconductor wafers during grinding with near-zero friction and contamination. Maintains wafer flatness within 0.1 microns. Essential part of wafer grinder/polisher equipment under 8442.40.00.00.