For the manufacture of semiconductor devices
Molding boxes for metal foundry; mold bases; molding patterns; molds for metal (other than ingot molds), metal carbides, glass, mineral materials, rubber or plastics: > Molds for rubber or plastics: > Injection or compression types: > For the manufacture of semiconductor devices
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8480.71.40.00
Silicon Wafer Injection Mold
Precision injection mold designed specifically for manufacturing plastic carrier trays and handling tools used in semiconductor wafer processing. It falls under HTS 8480.71.40.00 because it is an injection-type mold for plastics explicitly used in the production of semiconductor devices, aligning with statistical notes on wafer manufacturing equipment.
Semiconductor Chip Carrier Tray Mold
Multi-cavity injection mold producing plastic trays for transporting and storing semiconductor wafers and chips during fabrication. Meets HTS 8480.71.40.00 criteria for injection molds used in semiconductor device manufacture.
Wafer Ring Frame Injection Mold
Specialized mold for producing plastic ring frames that secure semiconductor wafers during dicing and backend processing. Falls under HTS 8480.71.40.00 due to its direct role in semiconductor manufacturing equipment preparation.
QFN Package Encapsulation Mold
Precision injection mold for Quad Flat No-lead (QFN) semiconductor package encapsulation, featuring fine-pitch cavities for exposed pad designs. HTS 8480.71.40.00 applies due to dedicated semiconductor device molding function.
Wafer Shippers Protective Mold
Injection mold for custom foam-like plastic inserts and shippers protecting semiconductor wafers during transport between fabs. Qualifies under HTS 8480.71.40.00 for supporting semiconductor manufacturing logistics.
Lead Frame Plastic Encapsulation Mold
High-precision mold for injection molding epoxy resin encapsulation on semiconductor lead frames during chip packaging. Classified under HTS 8480.71.40.00 as an injection-type mold for plastics integral to semiconductor device manufacturing processes.
BGA Substrate Molding Tool
Injection mold for encapsulating Ball Grid Array (BGA) semiconductor substrates with protective plastic compounds. Precisely classified in HTS 8480.71.40.00 for its application in advanced semiconductor packaging.