BGA Substrate Molding Tool
Injection mold for encapsulating Ball Grid Array (BGA) semiconductor substrates with protective plastic compounds. Precisely classified in HTS 8480.71.40.00 for its application in advanced semiconductor packaging.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If compression molding rather than injection
Injection/compression limited; other plastic molds classify differently.
If parts of semiconductor manufacturing machines if not a complete mold
Assemblies/parts for semiconductor equipment in electrical machinery chapter.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include mold flow analysis reports demonstrating suitability for high-fill-ratio BGA encapsulation
• Certify molds for use with semiconductor-grade epoxy molding compounds (EMCs)
Related Products under HTS 8480.71.40.00
Silicon Wafer Injection Mold
Precision injection mold designed specifically for manufacturing plastic carrier trays and handling tools used in semiconductor wafer processing. It falls under HTS 8480.71.40.00 because it is an injection-type mold for plastics explicitly used in the production of semiconductor devices, aligning with statistical notes on wafer manufacturing equipment.
Semiconductor Chip Carrier Tray Mold
Multi-cavity injection mold producing plastic trays for transporting and storing semiconductor wafers and chips during fabrication. Meets HTS 8480.71.40.00 criteria for injection molds used in semiconductor device manufacture.
Wafer Ring Frame Injection Mold
Specialized mold for producing plastic ring frames that secure semiconductor wafers during dicing and backend processing. Falls under HTS 8480.71.40.00 due to its direct role in semiconductor manufacturing equipment preparation.
QFN Package Encapsulation Mold
Precision injection mold for Quad Flat No-lead (QFN) semiconductor package encapsulation, featuring fine-pitch cavities for exposed pad designs. HTS 8480.71.40.00 applies due to dedicated semiconductor device molding function.
Wafer Shippers Protective Mold
Injection mold for custom foam-like plastic inserts and shippers protecting semiconductor wafers during transport between fabs. Qualifies under HTS 8480.71.40.00 for supporting semiconductor manufacturing logistics.
Lead Frame Plastic Encapsulation Mold
High-precision mold for injection molding epoxy resin encapsulation on semiconductor lead frames during chip packaging. Classified under HTS 8480.71.40.00 as an injection-type mold for plastics integral to semiconductor device manufacturing processes.