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8480.71.40.00/BGA Substrate Molding Tool/Japan

BGA Substrate Molding Tool from Japan

Injection mold for encapsulating Ball Grid Array (BGA) semiconductor substrates with protective plastic compounds. Precisely classified in HTS 8480.71.40.00 for its application in advanced semiconductor packaging.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include mold flow analysis reports demonstrating suitability for high-fill-ratio BGA encapsulation

• Certify molds for use with semiconductor-grade epoxy molding compounds (EMCs)

BGA Substrate Molding Tool from Japan — Import Duty Rate | HTS 8480.71.40.00