BGA Substrate Molding Tool from Japan
Injection mold for encapsulating Ball Grid Array (BGA) semiconductor substrates with protective plastic compounds. Precisely classified in HTS 8480.71.40.00 for its application in advanced semiconductor packaging.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include mold flow analysis reports demonstrating suitability for high-fill-ratio BGA encapsulation
• Certify molds for use with semiconductor-grade epoxy molding compounds (EMCs)