BGA Substrate Molding Tool from Canada
Injection mold for encapsulating Ball Grid Array (BGA) semiconductor substrates with protective plastic compounds. Precisely classified in HTS 8480.71.40.00 for its application in advanced semiconductor packaging.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include mold flow analysis reports demonstrating suitability for high-fill-ratio BGA encapsulation
• Certify molds for use with semiconductor-grade epoxy molding compounds (EMCs)