BGA Substrate Molding Tool from Germany
Injection mold for encapsulating Ball Grid Array (BGA) semiconductor substrates with protective plastic compounds. Precisely classified in HTS 8480.71.40.00 for its application in advanced semiconductor packaging.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include mold flow analysis reports demonstrating suitability for high-fill-ratio BGA encapsulation
• Certify molds for use with semiconductor-grade epoxy molding compounds (EMCs)