Wafer Ring Frame Injection Mold
Specialized mold for producing plastic ring frames that secure semiconductor wafers during dicing and backend processing. Falls under HTS 8480.71.40.00 due to its direct role in semiconductor manufacturing equipment preparation.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as accessories for semiconductor processing machines
Certain parts/accessories for specific machines in 8466 if not qualifying as molds.
If functioning more as a tap/tappet block than molding cavity
Other molds/ dies not elsewhere specified; precision depends on primary function.
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Import Tips & Compliance
• Document alignment with SEMI standards (e.g
• SEMI E47 for ring frames) to prove industry-specific use
• Ensure declarations specify 'for semiconductor wafer processing' to avoid general mold pitfalls
• Maintain records of heat-resistant material specs suitable for plasma dicing environments
Related Products under HTS 8480.71.40.00
Silicon Wafer Injection Mold
Precision injection mold designed specifically for manufacturing plastic carrier trays and handling tools used in semiconductor wafer processing. It falls under HTS 8480.71.40.00 because it is an injection-type mold for plastics explicitly used in the production of semiconductor devices, aligning with statistical notes on wafer manufacturing equipment.
Semiconductor Chip Carrier Tray Mold
Multi-cavity injection mold producing plastic trays for transporting and storing semiconductor wafers and chips during fabrication. Meets HTS 8480.71.40.00 criteria for injection molds used in semiconductor device manufacture.
QFN Package Encapsulation Mold
Precision injection mold for Quad Flat No-lead (QFN) semiconductor package encapsulation, featuring fine-pitch cavities for exposed pad designs. HTS 8480.71.40.00 applies due to dedicated semiconductor device molding function.
Wafer Shippers Protective Mold
Injection mold for custom foam-like plastic inserts and shippers protecting semiconductor wafers during transport between fabs. Qualifies under HTS 8480.71.40.00 for supporting semiconductor manufacturing logistics.
Lead Frame Plastic Encapsulation Mold
High-precision mold for injection molding epoxy resin encapsulation on semiconductor lead frames during chip packaging. Classified under HTS 8480.71.40.00 as an injection-type mold for plastics integral to semiconductor device manufacturing processes.
BGA Substrate Molding Tool
Injection mold for encapsulating Ball Grid Array (BGA) semiconductor substrates with protective plastic compounds. Precisely classified in HTS 8480.71.40.00 for its application in advanced semiconductor packaging.