8480.71.40.00/Wafer Ring Frame Injection Mold/China

Wafer Ring Frame Injection Mold from China

Specialized mold for producing plastic ring frames that secure semiconductor wafers during dicing and backend processing. Falls under HTS 8480.71.40.00 due to its direct role in semiconductor manufacturing equipment preparation.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Document alignment with SEMI standards (e.g

• SEMI E47 for ring frames) to prove industry-specific use

• Ensure declarations specify 'for semiconductor wafer processing' to avoid general mold pitfalls

• Maintain records of heat-resistant material specs suitable for plasma dicing environments

Wafer Ring Frame Injection Mold from China — Import Duty Rate | HTS 8480.71.40.00