8480.71.40.00/Wafer Ring Frame Injection Mold/Japan

Wafer Ring Frame Injection Mold from Japan

Specialized mold for producing plastic ring frames that secure semiconductor wafers during dicing and backend processing. Falls under HTS 8480.71.40.00 due to its direct role in semiconductor manufacturing equipment preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document alignment with SEMI standards (e.g

• SEMI E47 for ring frames) to prove industry-specific use

• Ensure declarations specify 'for semiconductor wafer processing' to avoid general mold pitfalls

• Maintain records of heat-resistant material specs suitable for plasma dicing environments