Wafer Ring Frame Injection Mold from Japan
Specialized mold for producing plastic ring frames that secure semiconductor wafers during dicing and backend processing. Falls under HTS 8480.71.40.00 due to its direct role in semiconductor manufacturing equipment preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document alignment with SEMI standards (e.g
• SEMI E47 for ring frames) to prove industry-specific use
• Ensure declarations specify 'for semiconductor wafer processing' to avoid general mold pitfalls
• Maintain records of heat-resistant material specs suitable for plasma dicing environments