Wafer Ring Frame Injection Mold from Canada
Specialized mold for producing plastic ring frames that secure semiconductor wafers during dicing and backend processing. Falls under HTS 8480.71.40.00 due to its direct role in semiconductor manufacturing equipment preparation.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document alignment with SEMI standards (e.g
• SEMI E47 for ring frames) to prove industry-specific use
• Ensure declarations specify 'for semiconductor wafer processing' to avoid general mold pitfalls
• Maintain records of heat-resistant material specs suitable for plasma dicing environments