Lead Frame Plastic Encapsulation Mold
High-precision mold for injection molding epoxy resin encapsulation on semiconductor lead frames during chip packaging. Classified under HTS 8480.71.40.00 as an injection-type mold for plastics integral to semiconductor device manufacturing processes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If designed for molding metal components rather than plastics
Molds for metal (not ingot molds) fall in 8480.60, separate from rubber/plastics molds.
If primarily for testing semiconductor packages rather than production molding
Testing machines/apparatus in Chapter 90; production molds stay in Chapter 84.
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Import Tips & Compliance
• Include process flow diagrams showing mold use in lead frame encapsulation to demonstrate semiconductor-specific application
• Verify mold cavity counts and runner designs match industry standards for IC packaging; retain supplier certifications
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