Lead Frame Plastic Encapsulation Mold from Germany
High-precision mold for injection molding epoxy resin encapsulation on semiconductor lead frames during chip packaging. Classified under HTS 8480.71.40.00 as an injection-type mold for plastics integral to semiconductor device manufacturing processes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include process flow diagrams showing mold use in lead frame encapsulation to demonstrate semiconductor-specific application
• Verify mold cavity counts and runner designs match industry standards for IC packaging; retain supplier certifications