Lead Frame Plastic Encapsulation Mold from Canada
High-precision mold for injection molding epoxy resin encapsulation on semiconductor lead frames during chip packaging. Classified under HTS 8480.71.40.00 as an injection-type mold for plastics integral to semiconductor device manufacturing processes.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include process flow diagrams showing mold use in lead frame encapsulation to demonstrate semiconductor-specific application
• Verify mold cavity counts and runner designs match industry standards for IC packaging; retain supplier certifications