8442.40.00.00/Semiconductor Wafer Polisher Head Assembly/Canada

Semiconductor Wafer Polisher Head Assembly from Canada

Complete polishing head with carrier film, retaining ring, and drive shaft for single/dual wafer polishers. Applies 2-7 psi pressure for planarization. Major replacement part for wafer polishers in 8442.40.00.00.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document removal rate specs (0.5-2.0 μm/min) and compatible pad types

• Complete head vs consumable pieces (retainer ring only) affects duty treatment

• Edge bead removal capability must be specified for advanced wafer classification

Semiconductor Wafer Polisher Head Assembly from Canada — Import Duty Rate | HTS 8442.40.00.00