Parts of the foregoing machinery, apparatus or equipment
Machinery, apparatus and equipment (other than the machines of headings 8456 to 8465), for preparing or making plates, cylinders or other printing components; plates, cylinders and other printing components; plates, cylinders and lithographic stones, prepared for printing purposes (for example, planed, grained or polished); parts thereof: > Parts of the foregoing machinery, apparatus or equipment
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8442.40.00.00
Czochralski Crystal Puller Replacement Heating Element
This graphite or molybdenum heating element is a critical replacement part for Czochralski crystal pullers used in semiconductor wafer boule production. It provides precise temperature control during the crystal growth process from molten silicon. Classified under 8442.40.00.00 as a part of machinery for preparing printing components, per statistical notes covering semiconductor crystal growers.
Semiconductor Wafer Slicing Diamond Saw Blade
Precision diamond-impregnated saw blade designed for slicing monocrystalline silicon boules into thin wafers for semiconductor fabrication. Ensures minimal kerf loss and high surface quality. Falls under 8442.40.00.00 as a part of wafer slicing saws in semiconductor preparation equipment.
Crystal Boule Grinder Spindle Assembly
High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Features air bearings for vibration-free operation. Classified as parts of wafer preparation equipment under 8442.40.00.00.
Wafer Lapping Machine Polishing Pad
Polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication. Designed for chemical-mechanical planarization compatibility. Part of wafer preparation apparatus under 8442.40.00.00.
Float Zone Crystal Grower RF Heating Coil
Radio frequency induction coil for float zone crystal growers producing ultra-pure silicon ingots without crucibles. Enables zone refining for high-resistivity wafers. Counts as parts of semiconductor crystal pullers/growers in 8442.40.00.00.
Wafer Grinder Air Bearing Chuck
Porous ceramic air bearing chuck that holds semiconductor wafers during grinding with near-zero friction and contamination. Maintains wafer flatness within 0.1 microns. Essential part of wafer grinder/polisher equipment under 8442.40.00.00.
Semiconductor Crystal Grinder Diamond Dresser
Single-crystal diamond dresser tool for truing and dressing grinding wheels in semiconductor boule grinders. Ensures consistent wheel profile for precise flat grinding. Replacement part for wafer preparation grinders in 8442.40.00.00.
Wafer Polishing Slurry Feed Nozzle
Sapphire or ceramic nozzle assembly that precisely delivers polishing slurry to wafer surfaces during CMP preparation. Controls flow rate for uniform material removal. Part of wafer polishing equipment under 8442.40.00.00.
Crystal Puller Seed Holder Chuck
Graphite or quartz seed holder chuck that precisely positions seed crystal dip into melt during Czochralski growth. Critical for consistent boule diameter control. Semiconductor crystal grower part under 8442.40.00.00.
Wafer Slicing Saw Coolant Nozzle Array
Multi-nozzle coolant delivery system for wire or blade wafer saws, maintaining blade temperature below 40°C during silicon slicing. Prevents thermal damage to wafers. Parts of wafer slicing saws under 8442.40.00.00.
Boule Grinder Workhead Assembly
Complete workhead with motor, spindle, and stroke mechanism for advancing crystal boules against grinding wheels. Provides micron-level diameter control. Major replacement part for semiconductor grinders in 8442.40.00.00.
Wafer Edge Grinder Profiling Wheel
Resin-bonded diamond wheel for beveling and profiling wafer edges to prevent chipping during handling and processing. Specific profiles for 200mm/300mm wafers. Part of wafer grinder equipment under 8442.40.00.00.
Crystal Puller Vacuum Chamber Lid
Stainless steel lid with viewport and ports for Czochralski puller vacuum chambers, maintaining argon atmosphere during growth. Double O-ring seal design. Structural part of crystal growing equipment in 8442.40.00.00.
Wafer Grinder Vibration Isolation Mounts
Active pneumatic isolation mounts that reduce vibration transmission to <1 nm RMS for ultra-precision wafer grinding. Critical for maintaining wafer bow specs. Parts of wafer grinder apparatus under 8442.40.00.00.
Semiconductor Wafer Polisher Head Assembly
Complete polishing head with carrier film, retaining ring, and drive shaft for single/dual wafer polishers. Applies 2-7 psi pressure for planarization. Major replacement part for wafer polishers in 8442.40.00.00.