Wafer Edge Grinder Profiling Wheel
Resin-bonded diamond wheel for beveling and profiling wafer edges to prevent chipping during handling and processing. Specific profiles for 200mm/300mm wafers. Part of wafer grinder equipment under 8442.40.00.00.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general grinding wheels
Millstones/abrasives of agglomerated synthetic diamonds use Chapter 68.
If hand-held power tool wheels
Smaller profile wheels for portable tools shift to Chapter 82.
Not sure which classification is right?
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Import Tips & Compliance
• Specify bevel angle (22.5°/45°) and wheel thickness for wafer size matching
• Bond hardness rating (M-Z) must be documented for grinding speed classification
• Avoid general abrasive wheel imports; semiconductor wafer specificity required
Related Products under HTS 8442.40.00.00
Czochralski Crystal Puller Replacement Heating Element
This graphite or molybdenum heating element is a critical replacement part for Czochralski crystal pullers used in semiconductor wafer boule production. It provides precise temperature control during the crystal growth process from molten silicon. Classified under 8442.40.00.00 as a part of machinery for preparing printing components, per statistical notes covering semiconductor crystal growers.
Semiconductor Wafer Slicing Diamond Saw Blade
Precision diamond-impregnated saw blade designed for slicing monocrystalline silicon boules into thin wafers for semiconductor fabrication. Ensures minimal kerf loss and high surface quality. Falls under 8442.40.00.00 as a part of wafer slicing saws in semiconductor preparation equipment.
Crystal Boule Grinder Spindle Assembly
High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Features air bearings for vibration-free operation. Classified as parts of wafer preparation equipment under 8442.40.00.00.
Wafer Lapping Machine Polishing Pad
Polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication. Designed for chemical-mechanical planarization compatibility. Part of wafer preparation apparatus under 8442.40.00.00.
Float Zone Crystal Grower RF Heating Coil
Radio frequency induction coil for float zone crystal growers producing ultra-pure silicon ingots without crucibles. Enables zone refining for high-resistivity wafers. Counts as parts of semiconductor crystal pullers/growers in 8442.40.00.00.
Wafer Grinder Air Bearing Chuck
Porous ceramic air bearing chuck that holds semiconductor wafers during grinding with near-zero friction and contamination. Maintains wafer flatness within 0.1 microns. Essential part of wafer grinder/polisher equipment under 8442.40.00.00.