8442.40.00.00/Wafer Edge Grinder Profiling Wheel/Japan

Wafer Edge Grinder Profiling Wheel from Japan

Resin-bonded diamond wheel for beveling and profiling wafer edges to prevent chipping during handling and processing. Specific profiles for 200mm/300mm wafers. Part of wafer grinder equipment under 8442.40.00.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify bevel angle (22.5°/45°) and wheel thickness for wafer size matching

• Bond hardness rating (M-Z) must be documented for grinding speed classification

• Avoid general abrasive wheel imports; semiconductor wafer specificity required