Wafer Edge Grinder Profiling Wheel from Germany
Resin-bonded diamond wheel for beveling and profiling wafer edges to prevent chipping during handling and processing. Specific profiles for 200mm/300mm wafers. Part of wafer grinder equipment under 8442.40.00.00.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify bevel angle (22.5°/45°) and wheel thickness for wafer size matching
• Bond hardness rating (M-Z) must be documented for grinding speed classification
• Avoid general abrasive wheel imports; semiconductor wafer specificity required