Wafer Edge Grinder Profiling Wheel from Canada
Resin-bonded diamond wheel for beveling and profiling wafer edges to prevent chipping during handling and processing. Specific profiles for 200mm/300mm wafers. Part of wafer grinder equipment under 8442.40.00.00.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify bevel angle (22.5°/45°) and wheel thickness for wafer size matching
• Bond hardness rating (M-Z) must be documented for grinding speed classification
• Avoid general abrasive wheel imports; semiconductor wafer specificity required