8442.40.00.00/Wafer Edge Grinder Profiling Wheel/Canada

Wafer Edge Grinder Profiling Wheel from Canada

Resin-bonded diamond wheel for beveling and profiling wafer edges to prevent chipping during handling and processing. Specific profiles for 200mm/300mm wafers. Part of wafer grinder equipment under 8442.40.00.00.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify bevel angle (22.5°/45°) and wheel thickness for wafer size matching

• Bond hardness rating (M-Z) must be documented for grinding speed classification

• Avoid general abrasive wheel imports; semiconductor wafer specificity required

Wafer Edge Grinder Profiling Wheel from Canada — Import Duty Rate | HTS 8442.40.00.00