Semiconductor Wafer Slicing Diamond Saw Blade
Precision diamond-impregnated saw blade designed for slicing monocrystalline silicon boules into thin wafers for semiconductor fabrication. Ensures minimal kerf loss and high surface quality. Falls under 8442.40.00.00 as a part of wafer slicing saws in semiconductor preparation equipment.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If treated as general circular saw blades
Standard metalworking saw blades classify under Chapter 82; semiconductor-specific use keeps it in 8442.
If parts of semiconductor wafer processing machines outside printing components prep
If not fitting statistical note for printing/semiconductor prep, may shift to parts of other semiconductor machines.
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Import Tips & Compliance
• Provide blade specifications including diamond grit size and inner/outer diameters for accurate HTS verification
• Document as consumable parts for semiconductor saws to prevent reclassification as general cutting tools
• Check for ITAR restrictions if blades exceed certain precision tolerances used in advanced semiconductors
Related Products under HTS 8442.40.00.00
Czochralski Crystal Puller Replacement Heating Element
This graphite or molybdenum heating element is a critical replacement part for Czochralski crystal pullers used in semiconductor wafer boule production. It provides precise temperature control during the crystal growth process from molten silicon. Classified under 8442.40.00.00 as a part of machinery for preparing printing components, per statistical notes covering semiconductor crystal growers.
Crystal Boule Grinder Spindle Assembly
High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Features air bearings for vibration-free operation. Classified as parts of wafer preparation equipment under 8442.40.00.00.
Wafer Lapping Machine Polishing Pad
Polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication. Designed for chemical-mechanical planarization compatibility. Part of wafer preparation apparatus under 8442.40.00.00.
Float Zone Crystal Grower RF Heating Coil
Radio frequency induction coil for float zone crystal growers producing ultra-pure silicon ingots without crucibles. Enables zone refining for high-resistivity wafers. Counts as parts of semiconductor crystal pullers/growers in 8442.40.00.00.
Wafer Grinder Air Bearing Chuck
Porous ceramic air bearing chuck that holds semiconductor wafers during grinding with near-zero friction and contamination. Maintains wafer flatness within 0.1 microns. Essential part of wafer grinder/polisher equipment under 8442.40.00.00.
Semiconductor Crystal Grinder Diamond Dresser
Single-crystal diamond dresser tool for truing and dressing grinding wheels in semiconductor boule grinders. Ensures consistent wheel profile for precise flat grinding. Replacement part for wafer preparation grinders in 8442.40.00.00.