Semiconductor Wafer Slicing Diamond Saw Blade from Germany
Precision diamond-impregnated saw blade designed for slicing monocrystalline silicon boules into thin wafers for semiconductor fabrication. Ensures minimal kerf loss and high surface quality. Falls under 8442.40.00.00 as a part of wafer slicing saws in semiconductor preparation equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide blade specifications including diamond grit size and inner/outer diameters for accurate HTS verification
• Document as consumable parts for semiconductor saws to prevent reclassification as general cutting tools
• Check for ITAR restrictions if blades exceed certain precision tolerances used in advanced semiconductors