Semiconductor Wafer Slicing Diamond Saw Blade from Japan
Precision diamond-impregnated saw blade designed for slicing monocrystalline silicon boules into thin wafers for semiconductor fabrication. Ensures minimal kerf loss and high surface quality. Falls under 8442.40.00.00 as a part of wafer slicing saws in semiconductor preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide blade specifications including diamond grit size and inner/outer diameters for accurate HTS verification
• Document as consumable parts for semiconductor saws to prevent reclassification as general cutting tools
• Check for ITAR restrictions if blades exceed certain precision tolerances used in advanced semiconductors