Semiconductor Wafer Slicing Diamond Saw Blade from China
Precision diamond-impregnated saw blade designed for slicing monocrystalline silicon boules into thin wafers for semiconductor fabrication. Ensures minimal kerf loss and high surface quality. Falls under 8442.40.00.00 as a part of wafer slicing saws in semiconductor preparation equipment.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide blade specifications including diamond grit size and inner/outer diameters for accurate HTS verification
• Document as consumable parts for semiconductor saws to prevent reclassification as general cutting tools
• Check for ITAR restrictions if blades exceed certain precision tolerances used in advanced semiconductors