Semiconductor Wafer Polisher Head Assembly from Japan
Complete polishing head with carrier film, retaining ring, and drive shaft for single/dual wafer polishers. Applies 2-7 psi pressure for planarization. Major replacement part for wafer polishers in 8442.40.00.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document removal rate specs (0.5-2.0 μm/min) and compatible pad types
• Complete head vs consumable pieces (retainer ring only) affects duty treatment
• Edge bead removal capability must be specified for advanced wafer classification